THINKPAD X1 CARBON GEN 12
PROCESSOR: INTEL CORE ULTRA 7 155H, 16C (6P + 8E + 2LPE) / 22T, MAX TURBO UP TO 4.8GHZ, 24MB
AI PC CATEGORY: AI PC
NPU: INTEL AI BOOST, UP TO 11 TOPS
GRAPHICS: INTEGRATED INTEL ARC GRAPHICS
CHIPSET: INTEL SOC PLATFORM
MEMORY:32GB SOLDERED LPDDR5X-6400
MEMORY SLOTS: MEMORY SOLDERED TO SYSTEMBOARD, NO SLOTS, 8-CHANNEL
MAX MEMORY: 32GB SOLDERED MEMORY, NOT UPGRADABLE
STORAGE: 1TB SSD M.2 2280 PCIE 4.0X4 NVME OPAL 2.0
STORAGE SUPPORT: ONE DRIVE, UP TO 2TB M.2 2280 SSD
STORAGE SLOT: ONE M.2 2280 PCIE® 4.0 X4 SLOT
BATTERY: INTEGRATED 57WH
POWER ADAPTER: 65W USB-C (2-PIN)
DISPLAY:14 WUXGA (1920X1200) IPS 400NITS ANTI-GLARE, 100% SRGB, 60HZ, LOW POWER
KEYBOARD: BACKLIT, SPANISH (LA)
CASE COLOR: BLACK, PAINT
CASE MATERIAL: CARBON FIBER (TOP), ALUMINIUM (BOTTOM)
DIMENSIONS (WXDXH): 312.80 X 214.75 X 14.96 MM (12.31 X 8.45 X 0.59 INCHES)
OPERATING SYSTEM: WINDOWS 11 PRO, SPANISH
BUNDLED SOFTWARE: INTEL CONNECTIVITY PERFORMANCE SUITE
ETHERNET: NO ONBOARD ETHERNET
WLAN + BLUETOOTH: INTEL WI-FI 7 BE200, 802.11BE 2X2 + BT5.3
STANDARD PORTS:
1X USB-A (USB 5GBPS / USB 3.2 GEN 1)
1X USB-A (USB 5GBPS / USB 3.2 GEN 1), ALWAYS ON
2X USB-C® (THUNDERBOLT 4 / USB4® 40GBPS), WITH USB PD 3.0 AND DISPLAYPORT 2.1
1X HDMI® 2.1, UP TO 4K/60HZ
1X HEADPHONE / MICROPHONE COMBO JACK (3.5MM)
SECURITY CHIP: DISCRETE TPM 2.0 ENABLED
FINGERPRINT READER: TOUCH STYLE, MATCH-ON-CHIP, IN KEYBOARD KEY
PHYSICAL LOCKS: KENSINGTON NANO SECURITY SLOT, 2.5 X 6 MM
PROCESSOR: INTEL CORE ULTRA 7 155H, 16C (6P + 8E + 2LPE) / 22T, MAX TURBO UP TO 4.8GHZ, 24MB
AI PC CATEGORY: AI PC
NPU: INTEL AI BOOST, UP TO 11 TOPS
GRAPHICS: INTEGRATED INTEL ARC GRAPHICS
CHIPSET: INTEL SOC PLATFORM
MEMORY:32GB SOLDERED LPDDR5X-6400
MEMORY SLOTS: MEMORY SOLDERED TO SYSTEMBOARD, NO SLOTS, 8-CHANNEL
MAX MEMORY: 32GB SOLDERED MEMORY, NOT UPGRADABLE
STORAGE: 1TB SSD M.2 2280 PCIE 4.0X4 NVME OPAL 2.0
STORAGE SUPPORT: ONE DRIVE, UP TO 2TB M.2 2280 SSD
STORAGE SLOT: ONE M.2 2280 PCIE® 4.0 X4 SLOT
BATTERY: INTEGRATED 57WH
POWER ADAPTER: 65W USB-C (2-PIN)
DISPLAY:14 WUXGA (1920X1200) IPS 400NITS ANTI-GLARE, 100% SRGB, 60HZ, LOW POWER
KEYBOARD: BACKLIT, SPANISH (LA)
CASE COLOR: BLACK, PAINT
CASE MATERIAL: CARBON FIBER (TOP), ALUMINIUM (BOTTOM)
DIMENSIONS (WXDXH): 312.80 X 214.75 X 14.96 MM (12.31 X 8.45 X 0.59 INCHES)
OPERATING SYSTEM: WINDOWS 11 PRO, SPANISH
BUNDLED SOFTWARE: INTEL CONNECTIVITY PERFORMANCE SUITE
ETHERNET: NO ONBOARD ETHERNET
WLAN + BLUETOOTH: INTEL WI-FI 7 BE200, 802.11BE 2X2 + BT5.3
STANDARD PORTS:
1X USB-A (USB 5GBPS / USB 3.2 GEN 1)
1X USB-A (USB 5GBPS / USB 3.2 GEN 1), ALWAYS ON
2X USB-C® (THUNDERBOLT 4 / USB4® 40GBPS), WITH USB PD 3.0 AND DISPLAYPORT 2.1
1X HDMI® 2.1, UP TO 4K/60HZ
1X HEADPHONE / MICROPHONE COMBO JACK (3.5MM)
SECURITY CHIP: DISCRETE TPM 2.0 ENABLED
FINGERPRINT READER: TOUCH STYLE, MATCH-ON-CHIP, IN KEYBOARD KEY
PHYSICAL LOCKS: KENSINGTON NANO SECURITY SLOT, 2.5 X 6 MM
BASE WARRANTY: 1-YEAR, COURIER OR CARRY-IN
INCLUDED UPGRADE: 3Y PREMIER SUPPORT UPGRADE FROM 1Y COURIER/CARRY-IN
LENOVO THINKPAD X1 CARBON 12VA GEN (14 AND #698; INTEL)
COMPAñERO DE TRABAJO ULTRAPORTáTIL LíDER EN LA INDUSTRIA DE 14 AND #698; PARA PROFESIONALES EN MOVIMIENTO.
LA PRIMERA LAPTOP DEL MUNDO CON PROCESADORES INTEL® CORE ULTRA, CON IA INTEGRADA.
THINKPAD X1 CARBON 12VA GEN ES LA PRIMERA LAPTOP DEL MUNDO QUE CUENTA CON LOS PROCESADORES INTEL® CORE ULTRA, LO QUE LA VUELVE IDEAL PARA CREAR Y PARA TENER PRODUCTIVIDAD EN CUALQUIER LUGAR. DISFRUTA DE UN DESEMPEñO OPTIMIZADO CON CARGAS DE TRABAJO LLEVADAS A MOTORES DE IA DEDICADOS, INCLUIDA LA UNIDAD DE PROCESAMIENTO NEURONAL (NEURAL PROCESSING UNIT, NPU) PARA TAREAS SOSTENIDAS Y UNA DURACIóN DE LA BATERíA RESILIENTE.
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